Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/24/2021
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Application #:
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16849017
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Filing Dt:
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04/15/2020
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Publication #:
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Pub Dt:
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07/30/2020
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Inventors:
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Koichi Motoyama, Benjamin D. Briggs, Gangadhara Raja Muthinti et al
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Title:
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Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barrier at Via Bottom
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| MICHAEL J. CHANG |
| 84 SUMMIT AVENUE |
| MICHAEL J. CHANG, LLC |
| MILFORD, CT 06460 |
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