Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/24/2021
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Application #:
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16865186
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Filing Dt:
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05/01/2020
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Inventors:
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Zhibai ZHONG, Chia-en LEE, Jinjian ZHENG, Lixun YANG, Chen-ke HSU, Junyong KANG
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Title:
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PROCESS FOR PACKAGING COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1721-1725, LVLING RD |
| SIMING DIST |
| XIAMEN, CHINA |
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| CHRISTOPHER B. LINDER |
| 3200 WINDY HILL ROAD SE |
| SUITE 1600E |
| ATLANTA, GA 30339 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 18, GAOXIN 5TH ROAD, GEDIAN DEVELOPMENT AREA, HUBEI |
| EZHOU, CHINA |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD. SUITE 405 |
| VIENNA, VA 22182 |
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