Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2021
|
Application #:
|
16284239
|
Filing Dt:
|
02/25/2019
|
|
Publication #:
|
|
Pub Dt:
|
10/03/2019
| | | | |
|
Inventors:
|
Loke Yip Foo, Choong Kooi Chee
|
|
Title:
|
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS WITH REDISTRIBUTION LAYER PACKAGING AND METHODS OF ASSEMBLING SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
|
|
|
|
| SCHWEGMAN, LUNDBERG & WOESSNER/INTEL |
| PO BOX 2938 |
| MINNEAPOLIS, MN 55402 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 101 INNOVATION DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
|
|
|
|
| ANGELA MILLER |
| C/O CLARIVATE |
| P.O. BOX 5427 |
| TUCSON, AZ 85703 |
|
|
Search Results as of:
06/14/2024 08:17 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
