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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/14/2021
Application #:
16599985
Filing Dt:
10/11/2019
Publication #:
Pub Dt:
04/16/2020
Inventors:
Denis Amparo, Oleg Mukhanov, Andrei Talalaeskii, John Vivalda, Daniel Yohannes et al
Title:
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
Assignment: 1
Reel/Frame:
057468/0901Recorded: 09/13/2021Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/11/2019
Exec Dt:
10/11/2019
Exec Dt:
10/11/2019
Exec Dt:
10/11/2019
Exec Dt:
10/11/2019
Exec Dt:
10/11/2019
Exec Dt:
10/17/2019
Exec Dt:
10/11/2019
Exec Dt:
10/11/2019
Assignee:
150 CLEARBROOK ROAD, 150
ELMSFORD, NEW YORK 10523
Correspondent:
STEVEN M HOFFBERG
29 BUCKOUT ROAD
HOFFBERG & ASSOCIATES
WEST HARRISON, NY 10604

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