Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/21/2021
|
Application #:
|
16334098
|
Filing Dt:
|
03/18/2019
|
|
Publication #:
|
|
Pub Dt:
|
12/05/2019
| | | | |
|
Inventors:
|
Thomas Richardson, Kyle Whitten, Vincent Paneccasio Jr., John Commander et al
|
|
Title:
|
Copper Deposition in Wafer Level Packaging of Integrated Circuits
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 245 FREIGHT STREET |
| WATERBURY, CONNECTICUT 06702 |
|
|
|
|
| CARMODY TORRANCE SANDAK & HENNESSEY LLP |
| 195 CHURCH STREET |
| PO BOX 1950 |
| NEW HAVEN, CT 06509-1950 |
|
|
Search Results as of:
06/07/2024 04:19 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
