Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2021
|
Application #:
|
16404841
|
Filing Dt:
|
05/07/2019
|
|
Publication #:
|
|
Pub Dt:
|
03/26/2020
| | | | |
|
Inventors:
|
Ju-Il CHOI, Pil-Kyu KANG, Hoechul KIM, Hoonjoo NA, Jaehyung PARK, Seongmin SON
|
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTION STRUCTURE INCLUDING COPPER AND TIN AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
|
|
|
|
| LEE & MORSE, P.C. |
| 3141 FAIRVIEW PARK DRIVE |
| SUITE 500 |
| FALLS CHURCH, VA 22042 |
|
|
Search Results as of:
06/14/2024 03:15 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
