Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/19/2021
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Application #:
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16055758
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Filing Dt:
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08/06/2018
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Publication #:
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Pub Dt:
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05/23/2019
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Inventors:
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Chia-Yu WEI, Cheng-Yuan LI, Hsin-Chi CHEN, Kuo-Cheng LEE, Hsun-Ying HUANG, Yen-Liang LIN
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Title:
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ANCHOR STRUCTURES AND METHODS FOR UNIFORM WAFER PLANARIZATION AND BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C. |
| C/O ROBERT SOKOHL |
| 1100 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20005 |
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