Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/23/2021
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Application #:
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16466158
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Filing Dt:
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06/03/2019
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Publication #:
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Pub Dt:
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02/27/2020
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Inventor:
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Sang Chul Lee
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Title:
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SEMICONDUCTOR MANUFACTURING COMPONENT COMPRISING DEPOSITION LAYER COVERING INTERLAYER BOUNDARY AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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71 GAEJEONGSANEOPDANJI-RO |
MIYANG-MYEON ANSEONG-SI GYEONGGI-DO, KOREA, REPUBLIC OF 17602 |
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PATENT DOCKET DEPARTMENT ARMSTRONG TEASD |
7700 FORSYTH BOULEVARD |
SUITE 1800 |
ST. LOUIS, MO 63105 |
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