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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11183493
Issue Dt:
11/23/2021
Application #:
16545105
Filing Dt:
08/20/2019
Publication #:
20200203331
Pub Dt:
06/25/2020
Inventors:
Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee
Title:
SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF
Assignment: 1
Reel/Frame:
066032/0339Recorded: 01/05/2024Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KIM, JIN YOUNG
Exec Dt:
10/30/2013
PARK, DOO HYUN
Exec Dt:
10/30/2013
YOON, JU HOON
Exec Dt:
11/01/2013
SEO, SEONG MIN
Exec Dt:
11/01/2013
RINNE, GLENN
Exec Dt:
10/31/2013
LEE, CHOON HEUNG
Exec Dt:
10/28/2013
Assignee:
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 W. MADISON ST
34TH FLOOR
CHICAGO, IL 60661
Assignment: 2
Reel/Frame:
055616/0001Recorded: 03/16/2021Pages: 43
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
AMKOR TECHNOLOGY, INC.
Exec Dt:
11/19/2019
Assignee:
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491 B RIVER VALLEY ROAD
VALLEY POINT #12/03
SINGAPORE, SINGAPORE 248373
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET
34TH FLOOR
CHICAGO, IL 60661

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