Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/21/2021
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Application #:
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16309797
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Filing Dt:
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12/13/2018
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Publication #:
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Pub Dt:
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08/08/2019
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Inventors:
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Xiangke Shi, Kevin P. Nelson
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Title:
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HEAT-SEAL LID WITH NON-HEAT SEALING LAYER AND HYDROPHOBIC OVERCOAT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 134 E. WISCONSIN AVENUE |
| ONE NEENAH CENTER 4TH FLOOR |
| NEENAH, WISCONSIN 54956 |
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| BEMIS COMPANY, INC. |
| PO BOX 669 |
| OFFICE OF INTELLECTUAL PROPERTY COUNSEL |
| NEENAH, 54957 UNITED STATES |
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