Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/2021
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Application #:
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16183503
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Filing Dt:
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11/07/2018
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Publication #:
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Pub Dt:
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11/07/2019
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Inventor:
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Jin Woo LEE
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Title:
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SENSOR PACKAGE WITH REDUCED HEIGHT CAVITY WALLS AND SENSOR PACKAGE MODULE INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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726, UNGNAM-RO, SEONGSAN-GU |
GYEONGSANGNAM-DO |
CHANGWON-SI, KOREA, REPUBLIC OF 51552 |
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SCHWABE WILLIAMSON & WYATT |
1211 SW FIFTH AVENUE |
SUITE 1900 |
PORTLAND, OR 97204 |
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09/25/2024 05:36 AM
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