Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/04/2022
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Application #:
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16656384
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Filing Dt:
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10/17/2019
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Publication #:
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Pub Dt:
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04/22/2021
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Inventors:
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Chia-Lin Chuang, Chia-Hao Chang, Sheng-Tsung Wang, Lin-Yu Huang, Tien-Lu Lin, Yu-Ming Lin et al
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Title:
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SEMICONDUCTOR STRUCTURE WITH A LAMINATED LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 300-78 |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP |
| 901 NEW YORK AVE., NW |
| WASHIGNTON, DC 20000 |
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