Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
01/11/2022
|
Application #:
|
16687865
|
Filing Dt:
|
11/19/2019
|
Publication #:
|
|
Pub Dt:
|
03/19/2020
| | | | |
Inventors:
|
Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
|
Title:
|
Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
|
|
|
PATENT LAW GROUP: ATKINS AND ASSOCIATES |
123 W. CHANDLER HEIGHTS ROAD, #12535 |
CHANDLER, AZ 85248 |
|
|
Search Results as of:
06/14/2024 11:03 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|