Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/18/2022
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Application #:
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16680214
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Filing Dt:
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11/11/2019
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Inventors:
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Wen-Luh LIAO, Cheng-Long YEH, Ko-Yin LAI, Yao-Ru CHANG, Yung-Fu CHANG, Yi HSIAO et al
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Title:
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SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| DITTHAVONG & STEINER P. C. |
| 44 CANAL CENTER PLAZA |
| SUITE 305 |
| ALEXANDRIA, VA 22314 |
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