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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/25/2022
Application #:
16819918
Filing Dt:
03/16/2020
Publication #:
Pub Dt:
09/16/2021
Inventors:
Yu-Hao Tsai, Mingmei Wang
Title:
Sidewall Protection Layer formation for Substrate Processing
Assignment: 1
Reel/Frame:
052980/0646Recorded: 06/18/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/17/2020
Exec Dt:
06/18/2020
Assignee:
AKASAKA BIZ TOWER
3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO, JAPAN 107-6325
Correspondent:
TOKYO ELECTRON U.S. HOLDINGS, INC.
2400 GROVE BLVD.
AUSTIN, TX 78741

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