Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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16748633
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Filing Dt:
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01/21/2020
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Publication #:
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Pub Dt:
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04/15/2021
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Inventors:
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Ferran Martorell, Prasad Subramaniam
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Title:
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HIGH DENSITY LOW POWER INTERCONNECT USING 3D DIE STACKING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2130 GOLD STREET |
| SUITE 100 |
| SAN JOSE, CALIFORNIA 95002 |
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| JORGE KINA |
| FENWICK & WEST LLP |
| 801 CALIFORNIA STREET |
| MOUNTAIN VIEW, CA 94041 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2953 BUNKER HILL LANE |
| SUITE 300 |
| SANTA CLARA, CALIFORNIA 95054 |
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| AMPACC LAW GROUP, PLLC |
| 6100 219TH ST. SW |
| SUITE 580 |
| MOUNTLAKE TERRACE, WA 98043 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TAI SENG CENTRE |
| 3 IRVING ROAD #10-01 |
| SINGAPORE, SINGAPORE 369522 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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