Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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15639932
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Filing Dt:
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06/30/2017
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Inventors:
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Brandon C. Hamilton, Kyle B. Snyder, Alan P. Boone
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Title:
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Microfluidic Manufactured Mesoscopic Microelectronics Interconnect
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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400 COLLINS ROAD NE |
M/S 124-323 |
CEDAR RAPIDS, IOWA 52498 |
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ROCKWELL COLLINS, INC./SUITER SWANTZ SUI |
14301 FNB PARKWAY |
SUITE 220 |
OMAHA, NE 68154 |
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09/24/2024 08:33 PM
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