Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2022
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Application #:
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16948712
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Filing Dt:
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09/29/2020
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Publication #:
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Pub Dt:
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10/28/2021
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Inventors:
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Lin-Yu HUANG, Li-Zhen YU, Chia-Hao CHANG, Cheng-Chi CHUANG, Kuan-Lun CHENG, Chih-Hao WANG
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Title:
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SEMICONDUCTOR DEVICE HAVING BACKSIDE VIA AND METHOD OF FABRICATING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAYNES AND BOONE, LLP IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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