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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11245061
Issue Dt:
02/08/2022
Application #:
16555100
Filing Dt:
08/29/2019
Publication #:
20200343429
Pub Dt:
10/29/2020
Inventors:
Seungjun Chung, Phillip Lee, Min Park, Sang-Soo Lee, Heesuk Kim, Jeong Gon Son et al
Title:
THERMOELECTRIC DEVICE HAVING A SEPARATE INTERLAYER DISPOSED BETWEEN A THERMOELECTRIC LEG AND AN ELECTRODE TO REDUCE THE CONTACT RESISTANCE THEREBETWEEN
Assignment: 1
Reel/Frame:
050211/0746Recorded: 08/29/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHUNG, SEUNGJUN
Exec Dt:
08/19/2019
LEE, PHILLIP
Exec Dt:
08/20/2019
PARK, MIN
Exec Dt:
08/19/2019
LEE, SANG-SOO
Exec Dt:
08/19/2019
KIM, HEESUK
Exec Dt:
08/19/2019
SON, JEONG GON
Exec Dt:
08/19/2019
PARK, JONG HYUK
Exec Dt:
08/19/2019
KIM, TAE ANN
Exec Dt:
08/19/2019
HWANG, SEONGKOWN
Exec Dt:
08/19/2019
JEONG, INHO
Exec Dt:
08/19/2019
Assignee:
KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
5, HWARANG-RO 14-GIL, SEONGBUK-GU
SEOUL, KOREA, REPUBLIC OF 02792
Correspondent:
RABIN & BERDO, P.C.
1101 14TH ST., N.W., SUITE 500
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
050450/0950Recorded: 09/20/2019Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 9TH INVENTOR'S NAME FROM SEONGKOWN HWANG TO SEONGKWON HWANG PREVIOUSLY RECORDED ON REEL 050211 FRAME 0746. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
CHUNG, SEUNGJUN
Exec Dt:
08/19/2019
LEE, PHILLIP
Exec Dt:
08/20/2019
PARK, MIN
Exec Dt:
08/19/2019
LEE, SANG-SOO
Exec Dt:
08/19/2019
KIM, HEESUK
Exec Dt:
08/19/2019
SON, JEONG GON
Exec Dt:
08/19/2019
PARK, JONG HYUK
Exec Dt:
08/19/2019
KIM, TAE ANN
Exec Dt:
08/19/2019
HWANG, SEONGKWON
Exec Dt:
08/19/2019
JEONG, INHO
Exec Dt:
08/19/2019
Assignee:
KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
5, HWARANG-RO 14-GIL, SEONGBUK-GU
SEOUL, KOREA, REPUBLIC OF 02792
Correspondent:
RABIN & BERDO, P.C.
1101 14TH ST., N.W., SUITE 500
WASHINGTON, DC 20005

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