Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/22/2022
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Application #:
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16902123
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Filing Dt:
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06/15/2020
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Publication #:
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Pub Dt:
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10/01/2020
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Inventors:
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MARK T. BOHR, ROBERT L. SANKMAN, WESLEY D. MC CULLOUGH, WILFRED GOMES, RAJESH KUMAR et al
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Title:
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DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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JUSTIN K. BRASK |
1211 SW 5TH AVENUE, STE. 1600 |
PORTLAND, OR 97204 |
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09/22/2024 06:06 AM
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