Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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16636638
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Filing Dt:
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02/04/2020
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Publication #:
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Pub Dt:
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05/20/2021
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Inventors:
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Yongtae KWON, Yong Woon YEO, Hyo Young KIM, Eung Ju LEE, Yun Mook PARK, Jun Kyu LEE et al
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Title:
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CHIP PACKAGE WITH CONNECTION PORTION THAT PASSES THROUGH AN ENCAPSULATION PORTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN |
CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 27651 |
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RENAISSANCE IP LAW GROUP LLP (PIP) |
17933 NW EVERGREEN PL, SUITE #121 |
BEAVERTON, OR 97006 |
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