Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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16730225
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Filing Dt:
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12/30/2019
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Publication #:
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Pub Dt:
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04/22/2021
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Inventors:
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Wei LIU, Shunfu CHEN, Cheng GAN
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Title:
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BACKSIDE DEEP ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICE ARRAYS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 88 WEILAI 3RD ROAD |
| EAST LAKE HIGH-TECH DEVELOPMENT ZONE |
| WUHAN, HUBEI, CHINA |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C |
| 1100 NEW YORK AVENUE, N.W. |
| WASHINGTON, DC 20005 |
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