Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/08/2022
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Application #:
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16630805
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Filing Dt:
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01/13/2020
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Publication #:
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Pub Dt:
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05/07/2020
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Inventors:
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Won Seok LEE, Jong Ju LEE, Seok Goo JANG, Hye Jeong OK, Hyung Seop SHIM, Jeong Su CHOI et al
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Title:
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THERMOPLASTIC RESIN COMPOSITION AND THERMOPLASTIC RESIN MOLDED ARTICLE PREPARED BY USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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128, YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07336 |
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AMPACC LAW GROUP, PLLC |
6100 219TH ST SW #580 |
MOUNTLAKE TERRACE, WA 98043 |
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