Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/08/2022
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Application #:
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15876046
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Filing Dt:
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01/19/2018
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Publication #:
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Pub Dt:
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05/24/2018
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Inventors:
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Godfrey Dimayuga, Jefferson Talledo
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Title:
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MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
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| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE |
| SUITE 300 |
| COPPELL, TX 75019 |
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