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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/08/2022
Application #:
17110631
Filing Dt:
12/03/2020
Publication #:
Pub Dt:
06/17/2021
Inventors:
Martin O'Toole, Zsolt Tokei, Christopher Wilson, Ryan Ryoung han Kim
Title:
Method for Forming a Via Hole Self-aligned with a Metal Block on a Substrate
Assignment: 1
Reel/Frame:
054888/0602Recorded: 01/12/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/12/2021
Exec Dt:
12/04/2020
Exec Dt:
12/16/2020
Exec Dt:
12/04/2020
Assignee:
KAPELDREEF 75
LEUVEN, BELGIUM 3001
Correspondent:
MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
300 SOUTH WACKER DRIVE
3100
CHICAGO, IL 60606

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