Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/08/2022
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Application #:
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17110631
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Filing Dt:
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12/03/2020
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Publication #:
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Pub Dt:
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06/17/2021
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Inventors:
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Martin O'Toole, Zsolt Tokei, Christopher Wilson, Ryan Ryoung han Kim
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Title:
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Method for Forming a Via Hole Self-aligned with a Metal Block on a Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 SOUTH WACKER DRIVE |
| 3100 |
| CHICAGO, IL 60606 |
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