Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/05/2022
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Application #:
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16639085
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Filing Dt:
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02/13/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Inventors:
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Preston T. MEYERS, Javier A. FALCON, Shawna M. LIFF, Joe R. SAUCEDO, Adel A. ELSHERBINI et al
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Title:
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TSV-LESS DIE STACKING USING PLATED PILLARS/THROUGH MOLD INTERCONNECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1211 SW 5TH AVENUE, STE. 1600 |
| PORTLAND, OR 97204 |
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05/28/2024 02:41 PM
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