Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/12/2022
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Application #:
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17128204
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Filing Dt:
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12/21/2020
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Inventors:
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TZU-HSUAN WANG, TZE-YANG YEH, CHIH-HUNG SHIH
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Title:
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IGBT MODULE WITH HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10F., NO. 455, SEC. 2, WENHUA 3RD RD., |
| LINKOU DIST., |
| NEW TAIPEI CITY, TAIWAN 244 |
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| LI & CAI INTELLECTUAL PROPERTY OFFICE |
| 9F, NO. 69, SEC. 2 DUNHUA S. RD |
| DA''AN DISTRICT |
| TAIPEI, 11106 TAIWAN |
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