Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2022
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Application #:
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16663366
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Filing Dt:
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10/25/2019
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Publication #:
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Pub Dt:
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04/30/2020
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Inventors:
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Tsang-Yu LIU, Wei-Ming CHIEN, Po-Han LEE
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Title:
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CHIP PACKAGE AND POWER MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F., NO. 23, JILIN RD. |
ZHONGLI DIST. |
TAOYUAN CITY, TAIWAN 320 |
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WEN LIU |
350 S. FIGUEROA STREET, SUITE 975 |
LOS ANGELES, CA 90071 |
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09/24/2024 10:23 AM
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