Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2022
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Application #:
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16929004
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Filing Dt:
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07/14/2020
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Publication #:
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Pub Dt:
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01/20/2022
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Inventors:
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Stanley Seungchul SONG, Periannan CHIDAMBARAM, Jonghae KIM
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Title:
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THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) INTEGRATION OF AN EMBEDDED CHIP AND A PREFORMED METAL ROUTING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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