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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/26/2022
Application #:
16211089
Filing Dt:
12/05/2018
Publication #:
Pub Dt:
06/13/2019
Inventors:
Yenheng CHEN, Chengchung LIN, Chengtar WU, Jangshen LIN
Title:
SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE
Assignment: 1
Reel/Frame:
050754/0437Recorded: 10/17/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/15/2019
Exec Dt:
03/15/2019
Exec Dt:
03/15/2019
Exec Dt:
04/10/2019
Assignee:
78 CHANGSHAN AVENUE
HUAIYIN DISTRICT
JIANGYIN CITY, CHINA 214437
Correspondent:
ALSTON & BIRD LLP
BANK OF AMERICA PLAZA
101 SOUTH TRYON STREET, SUITE 4000
CHARLOTTE, NC 28280-4000

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