Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/10/2022
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Application #:
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16325156
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Filing Dt:
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02/12/2019
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Publication #:
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Pub Dt:
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07/25/2019
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Inventors:
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Hyung Sub LEE, Min Seung SHIN, In Soo KIM, Min Cheol JU, Sung Won HONG
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Title:
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METHOD OF PREPARING THERMOPLASTIC RESIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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128, YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 07336 |
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AMPACC LAW GROUP PLLC |
6100 219TH ST SW, STE 580 |
MOUNTLAKE TERRACE, WA 98043 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE COUNTRY PREVIOUSLY RECORDED AT REEL: 048317 FRAME: 0106. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
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128, YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07336 |
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COLLIN W. PARK |
MORGAN, LEWIS & BOCKIUS LLP |
1111 PENNSYLVANIA AVE, NW |
WASHINGTON, DC 20004 |
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09/26/2024 10:10 AM
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