Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/10/2022
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Application #:
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16855690
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Filing Dt:
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04/22/2020
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Publication #:
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Pub Dt:
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04/01/2021
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Inventors:
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Lin-Yu HUANG, Li-Zhen YU, Cheng-Chi CHUANG, Chih-Hao WANG, Yu-Ming LIN
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Title:
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Via structure having a Metal Hump for Low Interface Resistance
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| BIRCH STEWART KOLASCH & BIRCH LLP |
| 8110 GATEHOUSE ROAD, SUITE 100 EAST |
| FALLS CHURCH, VA 22042 |
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05/29/2024 03:45 PM
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