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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	11335496	Issue Dt:	05/17/2022	Application #:	16294575	Filing Dt:	03/06/2019
Publication #:	20200020477	Pub Dt:	01/16/2020
Inventors:	Tai Yon CHO, Ju Hwan YANG, No Il PARK, Tae Jun CHOI, Byung Soo KANG, Yoon Mi CHA et al
Title:	COIL COMPONENT

Assignment: 1

Reel/Frame:

048522/0842

Recorded: 03/06/2019

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

KANG, BYUNG SOO

Exec Dt:

02/13/2019

CHO, TAI YON

Exec Dt:

02/13/2019

CHA, YOON MI

Exec Dt:

02/13/2019

YANG, JU HWAN

Exec Dt:

02/14/2019

YANG, JEONG SUONG

Exec Dt:

02/14/2019

PARK, NO IL

Exec Dt:

02/13/2019

MOON, BYEONG CHEOL

Exec Dt:

02/14/2019

CHOI, TAE JUN

Exec Dt:

02/13/2019

LIM, SEUNG MO

Exec Dt:

02/14/2019

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD.

MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU

SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Correspondent:

MORGAN LEWIS & BOCKIUS LLP

1111 PENNSYLVANIA AVENUE, NW

WASHINGTON, DC 20004

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