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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/17/2022
Application #:
16832084
Filing Dt:
03/27/2020
Publication #:
Pub Dt:
10/01/2020
Inventors:
Pao-Hung Chou, Shih-Ping Hsu, Chun-Hsien Yu
Title:
SEMICONDUCTOR PACKAGE SUBSTRATE, ELECTRONIC PACKAGE AND METHODS FOR FABRICATING THE SAME
Assignment: 1
Reel/Frame:
052243/0035Recorded: 03/27/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/16/2020
Exec Dt:
03/16/2020
Exec Dt:
03/16/2020
Assignee:
NO. 458-17, XINXING RD.
HUKOU TOWNSHIP
HSINCHU COUNTY, TAIWAN 30353
Correspondent:
AMIN, TUROCY & WATSON, LLP
200 PARK AVENUE
SUITE 300
BEACHWOOD, OH 44122

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