Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2022
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Application #:
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16832084
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Filing Dt:
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03/27/2020
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Publication #:
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Pub Dt:
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10/01/2020
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Inventors:
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Pao-Hung Chou, Shih-Ping Hsu, Chun-Hsien Yu
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Title:
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SEMICONDUCTOR PACKAGE SUBSTRATE, ELECTRONIC PACKAGE AND METHODS FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 458-17, XINXING RD. |
HUKOU TOWNSHIP |
HSINCHU COUNTY, TAIWAN 30353 |
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AMIN, TUROCY & WATSON, LLP |
200 PARK AVENUE |
SUITE 300 |
BEACHWOOD, OH 44122 |
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