Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2022
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Application #:
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16899515
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Filing Dt:
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06/11/2020
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Publication #:
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Pub Dt:
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12/16/2021
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Inventors:
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Wu Chou HSU, Min-Yao CHEN, Chih-Cheng LEE, Hsing Kuo TIEN
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Title:
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PACKAGE SUBSTRATE, ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| FOLEY & LARDNER LLP |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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