Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2022
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Application #:
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16106926
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Filing Dt:
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08/21/2018
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Publication #:
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Pub Dt:
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02/27/2020
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Inventors:
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Tejpal Singh, Gerald S. Pasdast, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan
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Title:
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FAST-LANE ROUTING FOR MULTI-CHIP PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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MICHAEL MOORE |
2816 LAGO VISTA LANE |
PATENT CAPITAL GROUP |
ROCKWALL, TX 75032 |
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05/29/2024 08:18 PM
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