Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/24/2022
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Application #:
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16721277
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Filing Dt:
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12/19/2019
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Publication #:
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Pub Dt:
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06/25/2020
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Inventors:
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Stefan Cosemans, Zsolt Tokei, Julien Ryckaert
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Title:
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Integrated Circuit with an Interconnection System having a Multilevel Layer Providing Multilevel Routing Tracks and Method of Manufacturing the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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KAPELDREEF 75 |
LEUVEN, BELGIUM 3001 |
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MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
300 SOUTH WACKER DRIVE |
3100 |
CHICAGO, IL 60606 |
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09/23/2024 02:44 AM
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