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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/24/2022
Application #:
17025563
Filing Dt:
09/18/2020
Publication #:
Pub Dt:
07/01/2021
Inventors:
Meng-Sheng CHANG, Chien-Ying CHEN, Chia-En HUANG, Yih WANG
Title:
INTEGRATED CIRCUIT LAYOUT, METHOD, STRUCTURE, AND SYSTEM
Assignment: 1
Reel/Frame:
053820/0168Recorded: 09/18/2020Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/09/2020
Exec Dt:
06/09/2020
Exec Dt:
06/09/2020
Exec Dt:
06/09/2020
Assignee:
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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