Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2022
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Application #:
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15775340
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Filing Dt:
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05/10/2018
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Publication #:
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Pub Dt:
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06/03/2021
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Inventors:
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Tae Young JEON, Jong Beom KIM, Eun Seon PARK, Joo Byung CHAI, Yu Sung JUNG et al
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Title:
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THERMOPLASTIC RESIN AND THERMOPLASTIC RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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128, YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07336 |
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AMPACC LAW GROUP, PLLC |
6100 219TH ST. SW |
SUITE 580 |
MOUNTLAKE TERRACE, WA 98043 |
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