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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/07/2022
Application #:
17094408
Filing Dt:
11/10/2020
Publication #:
Pub Dt:
02/25/2021
Inventors:
Lin-Lin Chih, Chien-Hung Chen, Guan-Jhih Liou, Yu-Hsun Hsu
Title:
WAFER INSPECTION METHOD AND WAFER PROBING SYSTEM
Assignment: 1
Reel/Frame:
054441/0970Recorded: 11/23/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/12/2020
Exec Dt:
11/12/2020
Exec Dt:
11/12/2020
Exec Dt:
11/12/2020
Assignee:
NO. 155, CHUNG-HO STREET
CHU-PEI CITY, HSINCHU COUNTY, TAIWAN 302
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD
SUITE 100E
FALLS CHURCH, VA 22042

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