Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2022
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Application #:
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16715593
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Filing Dt:
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12/16/2019
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Publication #:
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Pub Dt:
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06/18/2020
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Inventors:
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Jan FISCHER, Tobias SPROGIES
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Title:
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SEMICONDUCTOR CHIP SCALE PACKAGE AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| JONKERBOSPLEIN 52 |
| NIJMEGEN, NETHERLANDS 6534 AB |
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| OHLANDT, GREELEY, RUGGIERO & PERLE, LLP |
| ONE LANDMARK SQUARE, 10TH FLOOR |
| STAMFORD, CT 06901 |
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06/17/2024 06:58 AM
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