Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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16551764
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Filing Dt:
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08/27/2019
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Publication #:
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Pub Dt:
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07/30/2020
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Inventors:
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Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
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Title:
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METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK, |
HSINCHU, TAIWAN 300 |
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KEYSTONE IP LAW |
17F., NO. 59, SEC. 2, DUNHUA S. RD., DAAN DIST., |
TAIPEI, 106 TAIWAN |
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06/17/2024 04:50 AM
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