Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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16737856
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Filing Dt:
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01/08/2020
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Publication #:
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Pub Dt:
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04/01/2021
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Inventors:
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Hsien-Wei Chen, Ming-Fa Chen, Ying-Ju Chen, Ching-Jung Yang, Sung-Feng Yeh
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Title:
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SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION AND VIA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
HSINCHU, TAIWAN 300-78 |
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JCIPRNET |
P.O. BOX 600 TAIPEI GUTING |
TAIPEI CITY, 10099 TAIWAN |
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09/27/2024 06:40 AM
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