Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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17263438
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Filing Dt:
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01/26/2021
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Publication #:
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Pub Dt:
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12/16/2021
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Inventors:
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Jiancang WEI, Shujun WANG, Shiliang WU, Qing TONG
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Title:
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SEALING ASSEMBLY FOR ELECTRONIC COMPONENT AND UNDERWATER BOOSTER
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| BUILDING 7, JINBIN DEVELOPMENT INDUSTRIAL PARK |
| #45 MUNING ROAD, TEDA |
| TIANJIN, CHINA 300457 |
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| SAND, SEBOLT & WERNOW CO., LPA |
| 4940 MUNSON STREET NW |
| CANTON, OH 44718 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 45 MUNING ROAD, TEDA |
| BUILDING 7, JINBIN DEVELOPMENT INDUSTRIAL PARK |
| TIANJIN, CHINA 300457 |
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| SAND SEBOLT & WERNOW LPA |
| 4940 MUNSON ST. NW |
| AEGIS TOWER, SUITE 1100 |
| CANTON, OH 44718-3615 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| BUILDING 7, JINBIN DEVELOPMENT INDUSTRIAL PARK |
| 45 MUNNG ROAD, TEDA |
| TIANJIN, CHINA 300457 |
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| SAND, SEBOLT & WERNOW CO., LPA |
| 4940 MUNSON STREET NW |
| CANTON, OH 44718 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 7, JINBIN DEVELOPMENT INDUSTRIAL PARK |
| #45 MUNING ROAD |
| TIANJIN, CHINA 300457 |
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| SAND, SEBOLT & WERNOW CO., LPA |
| AEGIS TOWER, SUITE 1100 |
| 4940 MUNSON STREET, NW |
| CANTON, OH 44718-3615 |
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06/20/2024 04:58 PM
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