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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
06/21/2022
Application #:
16320282
Filing Dt:
01/24/2019
Publication #:
Pub Dt:
09/05/2019
Inventors:
Teck Kai Wong, Christopher G. Clark Jr., Edward Kelley, Rebekah F. Theisen
Title:
Improved SMA Resin Formulation
Assignment: 1
Reel/Frame:
048125/0182Recorded: 01/24/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/11/2016
Exec Dt:
08/11/2016
Exec Dt:
08/11/2016
Exec Dt:
08/11/2016
Assignee:
3100 W. RAY ROAD
SUITE 3100
CHANDLER, ARIZONA 85226
Correspondent:
MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
300 S. WACKER DRIVE
SUITE 3100
CHICAGO, IL 60606
Assignment: 2
Reel/Frame:
051368/0775Recorded: 12/26/2019Pages: 5
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/25/2019
Assignee:
875 THIRD AVENUE
NEW YORK, NEW YORK 10022
Correspondent:
NIR MAOZ, KTBS
1999 AVENUE OF THE STARS
39TH FLOOR
LOS ANGELES, CA 90067
Assignment: 3
Reel/Frame:
051369/0038Recorded: 12/26/2019Pages: 5
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/25/2019
Assignee:
875 THIRD AVENUE
NEW YORK, NEW YORK 10022
Correspondent:
NIR MAOZ, KTBS
1999 AVENUE OF THE STARS
39TH FLOOR
LOS ANGELES, CA 90067

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