Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/21/2022
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Application #:
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15856057
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Filing Dt:
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12/28/2017
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Publication #:
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Pub Dt:
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11/15/2018
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Inventors:
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Weichih LEE, Chihming LIN, Chienhui LEE
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Title:
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COMPOSITE LCP HIGH-FREQUENCY HIGH-SPEED DOUBLE-SIDED COPPER FOIL SUBSTRATE AND PREPARATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 169 HUANGPUJIANG MIDDLE ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE |
| KUNSHAN, CHINA |
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| GOKALP BAYRAMOGLU |
| 2520 ST. ROSE PARKWAY, SUITE 309 |
| HENDERSON, NV 89074 |
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