Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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17153634
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Filing Dt:
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01/20/2021
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Publication #:
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Pub Dt:
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05/26/2022
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Inventors:
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Xibi Liu, Jiwei Wu, Yongyi Qi, Chunku Cai, Ying Sun, Guoxing Yang, Fei Sun
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Title:
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MULTI-LAYER CHIP CERAMIC DIELECTRIC CAPACITOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10 GUANGMING WEST STREET |
| ECONOMIC & TECHNOLOGICAL DEVELOPMENT AREA |
| DALIAN, LIAONING, CHINA 116630 |
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| KEVIN AUSTAD |
| 150 SOUTH FIFTH STREET |
| SUITE 1200 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10, GUANGMING WEST STREET |
| ECONOMIC & TECHNOLOGICAL DEVELOPMENT AREA |
| DALIAN, LIAONING, CHINA 116630 |
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| KEVIN AUSTAD |
| 150 SOUTH FIFTH STREET |
| SUITE 1200 |
| MINNEAPOLIS, MN 55402 |
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06/27/2024 03:19 AM
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