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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/05/2022
Application #:
17153634
Filing Dt:
01/20/2021
Publication #:
Pub Dt:
05/26/2022
Inventors:
Xibi Liu, Jiwei Wu, Yongyi Qi, Chunku Cai, Ying Sun, Guoxing Yang, Fei Sun
Title:
MULTI-LAYER CHIP CERAMIC DIELECTRIC CAPACITOR
Assignment: 1
Reel/Frame:
055047/0822Recorded: 01/27/2021Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Assignee:
NO. 10 GUANGMING WEST STREET
ECONOMIC & TECHNOLOGICAL DEVELOPMENT AREA
DALIAN, LIAONING, CHINA 116630
Correspondent:
KEVIN AUSTAD
150 SOUTH FIFTH STREET
SUITE 1200
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
055444/0881Recorded: 03/01/2021Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Exec Dt:
01/20/2021
Assignee:
NO. 10, GUANGMING WEST STREET
ECONOMIC & TECHNOLOGICAL DEVELOPMENT AREA
DALIAN, LIAONING, CHINA 116630
Correspondent:
KEVIN AUSTAD
150 SOUTH FIFTH STREET
SUITE 1200
MINNEAPOLIS, MN 55402

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