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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11387171
Issue Dt:
07/12/2022
Application #:
15997378
Filing Dt:
06/04/2018
Publication #:
20180286787
Pub Dt:
10/04/2018
Inventors:
Hui-Min HUANG, Chih-Wei LIN, Chung-Shi LIU, Shou-Cheng HU, Ming-Da CHENG, Chen-Shien CHEN
Title:
METHOD OF PACKAGING A SEMICONDUCTOR DIE
Assignment: 1
Reel/Frame:
045982/0644Recorded: 06/04/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUANG, HUI-MIN
Exec Dt:
05/22/2012
HU, YEN-CHANG
Exec Dt:
05/22/2012
LIN, CHIH-WEI
Exec Dt:
05/22/2012
CHENG, MING-DA
Exec Dt:
05/22/2012
LIU, CHUNG-SHI
Exec Dt:
05/22/2012
CHEN, CHEN-SHIEN
Exec Dt:
05/22/2012
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
049148/0575Recorded: 05/10/2019Pages: 9
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND INVENTOR NAME PREVIOUSLY RECORDED AT REEL: 045982 FRAME: 0644. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
HUANG, HUI-MIN
Exec Dt:
05/22/2012
HU, SHOU-CHENG
Exec Dt:
03/12/2019
LIN, CHIH-WEI
Exec Dt:
05/22/2012
CHENG, MING-DA
Exec Dt:
05/22/2012
LIU, CHUNG-SHI
Exec Dt:
05/22/2012
CHEN, CHEN-SHIEN
Exec Dt:
05/22/2012
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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