Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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17023199
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Filing Dt:
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09/16/2020
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Publication #:
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Pub Dt:
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03/18/2021
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Inventors:
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Chia-Ming CHENG, Ming-Chung CHUNG, Po-Han LEE, Jiun-Yen LAI, Wei-Luen SUEN
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Title:
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CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 23, JILIN RD. |
| ZHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 320 |
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| WEN LIU |
| 350 S. FIGUEROA STREET, SUITE 975 |
| LOS ANGELES, CA 90071 |
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