Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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17326359
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Filing Dt:
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05/21/2021
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Inventors:
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SHIH-HSI TAI, TZE-YANG YEH
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Title:
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HEAT-DISSIPATING SUBSTRATE STRUCTURE WITH BUILT-IN CONDUCTIVE CIRCUITS
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10F., NO. 455, SEC. 2, WENHUA 3RD RD., |
LINKOU DIST., |
NEW TAIPEI CITY, TAIWAN 244 |
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LI & CAI INTELLECTUAL PROPERTY OFFICE |
9F, NO. 69, SEC. 2 DUNHUA S. RD |
DA''AN DISTRICT |
TAIPEI, 11106 TAIWAN |
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09/25/2024 07:18 PM
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